[FM-India]IEEE DASC 2024-Call for Papers-Deadline Extended to 15 July

Please accept our apologies if you receive multiple copies of IEEE DASC 2024 Preliminary CFPs. =====================CALL FOR PAPERS============================= The 22nd IEEE International Conference on Dependable, Autonomic and Secure Computing IEEE DASC 2024 http://cyber-science.org/2024/dasc/ joint conference IEEE DASC/PICom/CBDCom/CyberSciTech 2024 5-8 November 2024 - Boracay Island, Malay, Philippines =====================INTRODUCTION============================= As computer and communication systems, as well as other systems such as Cyber-Physical Systems (CPS), Internet of Things (IoT), and Autonomous Robotic Systems, become increasingly large and complex, their Dependability and Security play critical roles in supporting next-generation science, engineering, and commercial applications. It remains a challenge to design, analyze, evaluate, and improve the dependability and security of a large-scale computing environment. Trusted and autonomic computing/autonomous systems need synergistic research efforts covering many disciplines, from natural sciences to social sciences. It requires scientific and technological advances in a variety of fields, as well as new software, architectures, and communication technology that support the integration of the constituent technologies. IEEE DASC 2024 will be held during November 5-8, 2024, in Boracay Island, Malay, Philippines, co-located with IEEE CyberSciTech 2024, IEEE PICom 2024, and IEEE CBDCom 2024. It aims to bring together computer scientists, industrial engineers, and researchers to discuss and exchange theoretical and implementation results, novel designs, work-in-progress, experience, case studies, and trend-setting ideas in the areas of dependability, security, trust, and/or autonomic computing, and autonomous systems. =====================TRACKS AND TOPICS============================= - Track 1: Dependable and Fault-tolerant Computing - Track 2: Network and System Security and Privacy - Track 3: Autonomic Computing and Autonomous Systems - Track 4: Industrial Applications and Emerging Techniques - Track 5: Autonomic and Secure Computing with AI/ML Topics of interest include, but are not restricted to: - Self-Organization and Organic Computing - Cognitive Computing and Self-Aware Computing - Energy Management in Autonomic Computing and Autonomous Systems - Dependable & Fault-tolerant Computing in Big Data, CPS, IoT, SDN, and Real-time System - Hardware and Software Reliability, Verification and Testing - Security and Privacy in Cloud/Fog/Edge Computing, Mobile and Pervasive Computing, Big Data, CPS and IoT systems - Artificial Intelligence Techniques in Network and System Security and Privacy - Autonomic and Autonomous Issues in Cloud/Fog/Edge Computing, Mobile and Pervasive Computing, Big Data, CPS and IoT systems - Software/Apps/Tools Development for Dependable and Secure Applications - IoT and Sensor Network, Big Data, Smart Grid, Aerospace, Transportation Applications =====================IMPORTANT DATES========================== Paper Submission Due: 15 Jul 2024 (*EXTENDED) Authors Notification: 15 Aug 2024 Camera-ready Submission: 15 Sep 2024 =====================SUBMISSION INSTRUCTION=================== Authors are invited to submit their original research work that has not previously been submitted or published in any other venue. Regular, work-in-progress (WiP), workshop, and special session papers need to be submitted in IEEE CS Proceedings format. IEEE formatting info: http://www.ieee.org/conferences_events/conferences/publishing/templates.html All the accepted papers will be published by IEEE in the Conference Proceedings (IEEE-DL and EI indexed). Best Paper Awards will be presented to high quality papers. Selected papers will be recommended to prestigious journal Special Issues. Some papers originally submitted as full papers can be accepted as short papers during the review process. In such cases, the authors will need to reduce the paper accordingly when preparing the camera-ready version. At least one of the authors of any accepted paper is requested to register and present the paper at the conference. Regular Tracks: 6-8 pages - WiP/Workshop/Special Session Tracks: 4-6 pages =====================ORGANIZING COMMITTEE============================= -Honorary Chairs- - Tadashi Dohi, Hiroshima University, Japan - Mohammed Atiquzzaman, Univ. of Oklahoma, USA -General Chairs- - Zakirul Alam Bhuiyan, Fordham University, USA - Kenichi Kourai, Kyushu Inst. of Tech., Japan -General Executive Chairs- - Moayad Aloqaily, Mohamad Bin Zayed Univ., UAE - Bernady O. Apduhan, Kyushu Sangyo Univ., Japan -Program Chairs- - Wenjia Li, New York Institute of Technology, USA - Aniello Castiglione, University of Salerno, Italy -Program Co-chairs- - Mohamed Rahouti, Fordham University, USA - Wei Wang, Beijing Jiaotong University, China - Adnan Anwar, Deakin University, Australia - Shan Jiang, The Hong Kong Polytechnic University, Hong Kong - Changqing Luo, Virginia Commonwealth Univ., USA - Lei Chen, Georgia Southern University, USA -Workshop & Special Session Chairs- - Preeti Mishra, Doon University, India - Arafatur Rahman, University of Wolverhampton, UK -WiP & LBI Chairs- - Saqib Ali, Univ. of Agri. Faisalabad, Pakistan - Mrinal Kanti Bhowmik, Tripura University, India -Publicity Chairs- - Mubashir Rehmani, Cork Inst. of Tech., Ireland - Junjun Zheng, Hiroshima University, Japan - Qin Liu, Hunan University, China - Senthil Kumar, Mepco Schlenk Eng. College, India - Yuhong Liu, Santa Clara University, USA -Steering Committee- - Jianhua Ma, Hosei University, Japan - Laurence T. Yang, St. Francis Xavier Univ., Canada - Yuanshun Dai, Univ. of Elec. Sci. & Tech. of China, China - Tadashi Dohi, Hiroshima University, Japan - Zakirul Alam Bhuiyan, Fordham University, USA Program Committee: Please check the "Program Committee" web page on the conference website for details: http://cyber-science.org/2024/dasc/tpc/ Contact: Please email inquiries concerning DASC 2024 to Prof. Zakirul Alam Bhuiyan: zakirulalam AT gmail DOT com.